104977

Description: Active Cooler LGA1700 incl. Backplate Hersteller: HSM ZAMECKI Matchcode: S3SA-DSD1-E121Z Rutronik No.: DISACC1632 VPE: 1 MOQ: 1 Verpackung: BOX

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Parameter

Kühler Lösung: ACTIVE
Lüfteranschluss: 4-PIN PWM
Heatpipe incl.: Y Y/N
Befestigung: SCREWS
Gehäuse Höhe: 4U
Zubehör: BACKPLATE
Sockelart: LGA1700
Kühlermaterial: COMPOUND
Höhe: 100 mm
Breite: 92 mm
Länge: 95 mm
Gewicht: 500 g
Anpassungsbaugruppe: DISACC1751
Automotive: NO
RoHS Status: RoHS-conform
Verpackung: BOX

ECCN: EAR99
Zolltarifnummer: 84733080000
Land: Taiwan
ABC-Schlüssel: A
Lieferzeit beim Hersteller: 15 Wochen

Beschreibung

Active cooling solution designed for Alder Lake / Raptor Lake processors based on the LGA1700 socket. The 3U active aluminum heatsink with copper base and 4 heat pipes consists of Cooler and Backplate.

Characteristics:

Heatsink Material: Aluminum with copper base and 4 heat pipes
Fastener: Screw & Spring
PWM Fan: F129025BUAF4Q8aR with two ball bearing
Fan Speed: 800 - 3450 rpm, Air Flow: 16.29 - 70.24 CFM, Noise Level: 21 - 43 dB-A
Dimensions (L x W x H): 95 x 92 x 103 [mm]
Weight: 457 g
Thermal Material: X23-7762
Thermal Resistance: 0.152 °C/W
RoHS & REACh compliant
Made in PRC